Massachusetts Institute of Technology
3.155J/6.152J
Microelectronics Processing Technology
Fall Term 2003
Instructions for the MEMS Lab Report
Your lab report should follow the format of the IEEE Electron Device Letters,The format from
the IC Lab report will be used,
Contents,Your Letter should include the following sections,
Title
By-line (Author,affiliation,and submission date)
Abstract (50–200 words)
Introduction
Experiment
Results and Discussion
Conclusion
References
Although Letters do not usually have appendices,you should attach the following two appendices
so the professors can better evaluate your work,
Appendix A,Data
Appendix B,Calculations
See the lecture slides,How to Write an IEEE Letter” for details about what should appear in each
section and appendix,In addition,the lecture on Monday,October 27
th
will provide more details,
Length,Follow the guidance from the IC Lab Report on length,
Limiting the Letter’s length will be challenging,Use the following to focus your writing,
Purpose,The purpose of your Letter is to evaluate the mechanical properties of the
low-stress silicon nitride structure you fabricated,and to discuss any differences
between those properties and the properties predicted by the literature,The literature
includes the paper by Sekimoto (on the course web site),and literature on mechanical
properties (Modulus) of silicon nitride to be posted to the web site next week,YOU
SHOULD FOLLOW THE GUIDANCE FROM THE OCTOBER 20
th
LECTURE TO
DETERMINE THE TECHNICAL CONTENT TO BE INCLUDED,
Audience,You may assume that your audience is familiar with microelectronics,
Grading,For the MEMS Lab,you will receive a writing grade on your Letter and a technical
grade based on your Letter and Appendices,The technical grade will be based on your critical
evaluation of the material properties,and your comparison with the literature data,The first draft
grade will be based on completeness,
3 points, Complete,Acceptable as final draft,
2 points, Significant work,but a section or figure is missing,or the writing quality is very
rough,
1 point, Multiple sections &/or graphs are missing or are merely outlined,
Deadlines,Multiple deadlines exist for this Letter,as listed below,
Wednesday,October 29
th
(in class) Hand in a summary sheet with the data listed below,
You will receive e-mail by Thursday morning indicating
if the data looks OK,This is intended to provide
feedback as to whether you are on the right track,and as
such will not be graded,
Monday,November 3
rd
(e-mail) Email BEFORE CLASS the completed Letter,
Wednesday,November 12
th
(in class) You will receive feedback on the writing quality,and a
partial grade,
Friday,November 21
st
(e-mail) E-mail by 5PM your final Letter for final writing
and technical grades,Appendices may be submitted the
following Monday
Data required in summary for October 29
th
,
For EVERY device tested by your group,provide,
DEVICE SIZE (e.g,5x50 Cantilever)
LOAD RANGE (e.g,0-200microNewtons)
EXTRACTED MODULUS (or an explanation of why it’s not possible to extract)
This should be no more than 1 paragraph or a table,e.g.;
Device Size Load Range Modulus Comments
5x50 Cantilever 0-2000 microNewtons xxx GPa
5x100 Fixed-Fixed Bridge 0-100 microNewtons N/A Data too noisy
……,…… ….,….,
3.155J/6.152J
Microelectronics Processing Technology
Fall Term 2003
Instructions for the MEMS Lab Report
Your lab report should follow the format of the IEEE Electron Device Letters,The format from
the IC Lab report will be used,
Contents,Your Letter should include the following sections,
Title
By-line (Author,affiliation,and submission date)
Abstract (50–200 words)
Introduction
Experiment
Results and Discussion
Conclusion
References
Although Letters do not usually have appendices,you should attach the following two appendices
so the professors can better evaluate your work,
Appendix A,Data
Appendix B,Calculations
See the lecture slides,How to Write an IEEE Letter” for details about what should appear in each
section and appendix,In addition,the lecture on Monday,October 27
th
will provide more details,
Length,Follow the guidance from the IC Lab Report on length,
Limiting the Letter’s length will be challenging,Use the following to focus your writing,
Purpose,The purpose of your Letter is to evaluate the mechanical properties of the
low-stress silicon nitride structure you fabricated,and to discuss any differences
between those properties and the properties predicted by the literature,The literature
includes the paper by Sekimoto (on the course web site),and literature on mechanical
properties (Modulus) of silicon nitride to be posted to the web site next week,YOU
SHOULD FOLLOW THE GUIDANCE FROM THE OCTOBER 20
th
LECTURE TO
DETERMINE THE TECHNICAL CONTENT TO BE INCLUDED,
Audience,You may assume that your audience is familiar with microelectronics,
Grading,For the MEMS Lab,you will receive a writing grade on your Letter and a technical
grade based on your Letter and Appendices,The technical grade will be based on your critical
evaluation of the material properties,and your comparison with the literature data,The first draft
grade will be based on completeness,
3 points, Complete,Acceptable as final draft,
2 points, Significant work,but a section or figure is missing,or the writing quality is very
rough,
1 point, Multiple sections &/or graphs are missing or are merely outlined,
Deadlines,Multiple deadlines exist for this Letter,as listed below,
Wednesday,October 29
th
(in class) Hand in a summary sheet with the data listed below,
You will receive e-mail by Thursday morning indicating
if the data looks OK,This is intended to provide
feedback as to whether you are on the right track,and as
such will not be graded,
Monday,November 3
rd
(e-mail) Email BEFORE CLASS the completed Letter,
Wednesday,November 12
th
(in class) You will receive feedback on the writing quality,and a
partial grade,
Friday,November 21
st
(e-mail) E-mail by 5PM your final Letter for final writing
and technical grades,Appendices may be submitted the
following Monday
Data required in summary for October 29
th
,
For EVERY device tested by your group,provide,
DEVICE SIZE (e.g,5x50 Cantilever)
LOAD RANGE (e.g,0-200microNewtons)
EXTRACTED MODULUS (or an explanation of why it’s not possible to extract)
This should be no more than 1 paragraph or a table,e.g.;
Device Size Load Range Modulus Comments
5x50 Cantilever 0-2000 microNewtons xxx GPa
5x100 Fixed-Fixed Bridge 0-100 microNewtons N/A Data too noisy
……,…… ….,….,
