3.155J/6.152J Lecture 1,
Introduction
Prof,Martin A,Schmidt
Massachusetts Institute of Technology
9/3/2003
1
Outline
Introductions
Staff
You
Motivation
Course Organization
Handout
Lab Assignments
Safety
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 2
Tiny Technologies
A definition which captures two
extremes,
Miniaturization
Making things smaller,often using Integrated
Circuit process technologies
Atom-level Manipulation/Assembly/Growth
Often to achieve a unique material property
e.g,Carbon Nanotubes
We will focus on the former
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 3
The Driver,Microelectronics
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 4
Engineering Challenges of the 20
th
Century:
INCREASING SCALE
Brooklyn Bridge
Space V rocket
Hoover Dam
Boeing 747-400
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 6
Engineering Challenges of the 21
st
Century,
DECREASING SCALE
Portable,Distributed Systems
Manipulation of Small Things
Drugs
Biological Cells
Biological Matter
DNA
Proteins
Atoms
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 7
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 8
MIT Tiny Technologies
mm Pm nm
Microengines
Microchemical
Plants(Jensen)
Low Power DSP
(Chandrakasan)
Transistors
(delAlamo)
Connectors
(Slocum)
Biosensors
(Manalis)
Organization
Pre-Req
Total overhaul since last year
Spring ’03 was trial run
Three lab modules
IC
MEMS
Microfluidics
Lecture alignment with labs
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 9
Laboratory
Each session is 4 hours (9-1 or 1-5)
Tuesday,Thursday,Friday
Groups A,B,C,D,E,F
Each lab is 3 sessions
2 for processing,1 for testing
Three labs
IC, MOS Capacitor
MEMS, Silicon Nitride Microcantilever
Fluids, Micromixer
Lab report for each lab
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 10
Lectures
12 Topical Lectures
Vacuum,CVD,Oxidation,Diffusion/Implantation,
Lithography,Etching,Sputtering,Evaporation,
Interconnect
3 Lab Overview Lectures
Given in first week of lab
3 Lab Report Lectures
Given in last week of lab
5 Advanced Topic Lectures
Advanced Si Devices,Crystal Growth,Reliability,
Nanobio,Nanolithography
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 11
Grading
Quiz #1 and #2 (15% each)
Each Covers 6 Topical Lectures
Quiz #2 includes 3 advanced topic lectures
Take Home (15%)
Design Problem
Integrates Lectures
Lab Reports (10% each + 5% writing)
IC Lab – Satisfies CIM Requirements
Homework (10%)
Lab Participation (10%)
Lab instructor evaluations
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 12
Policy for Academic Conduct
Homework
Collaboration OK,everyone must contribute
Contributors must be identified
Take-Home and Quizzes
No collaboration
Lab Reports
Each group shares the same data,but…
Data reduction,analysis,discussion MUST be
done individually
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 13
Books,References
Lecturer will handout notes
Copies of chapters when appropriate
Recommended book,
Plummer
Other references
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 14
st
Half
Lecturer
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Schedule – 1
9/3
9/8
9/
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22
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10/1
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10/20
Day Date Topic Lab Assignments Due
MAS Overview Safety/Lab assignment
MAS IC Lab - Overview IC-1,Gate oxide/poly
9/10 Vacuum System No Assignment
15 CVD IC-2,Photolith/Etch
17 Oxidation HW1 (Vac/CVD
Student Holiday IC-3,Test
24 MAS IC Lab,Testing HW2 (CVD/Oxidation
29 Diffusion No Lab
RCOH Diffusion/Implantation IC Lab Report
10 MAS MEMS Lab,Overview MEMS-1,Backside
10/8 MAS Lithography HW3 Diffusion/Implant
10 13 Columbus Day-Holiday MEMS-2,KOH etch
10/15 MAS Lithography,Soft Lithography HW4 (Litho)
MAS MEMS Lab,Testing MEMS-3,Test
10/22 Staff Quiz#1 (up to Lithography Quiz#1
10/27 MAS Etching wet No Lab
10/29 MAS Etching dry MEMS Lab Report
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 15
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Schedule – 2
10/20
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11/10
11/19
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12/3
12/8
12/10
10 13 Columbus Day-Holiday MEMS-2,KOH etch
10/15 MAS Lithography,Soft Lithography HW4 (Litho)
MAS MEMS Lab,Testing MEMS-3,Test
10/22 Staff Quiz#1 (up to Lithography Quiz#1
10/27 MAS Etching wet No Lab
10/29 MAS Etching dry MEMS Lab Report
11/3 MAS Fluids Lab,Overview Fluids-1,Photolith
11/5 RCOH Sputtering HW5 etching
Veterans Day-Holiday No Lab
11/12 RCOH Evaporation Take Home
11/17 RCOH Interconnect Fluids-2,Molding
MAS Advanced Si Devices HW6 Sputtering,Evap,Int
11/24 RCOH Crystal Growth No Lab
11 26 Reliability IC Lab Resubmit
12/1 MAS Fluids Lab,Testing Fluids-3,Test
Staff Quiz#2,Soft Lith-Interconnect + 11/19,24,26 Lectures Quiz#2
Guest Special topic,Nanobio No Lab
RCOH Special topic,Nanolithography Fluids Lab Report
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 16
Safety
Sleep
Better safe than sorry
Be responsible
Ask questions
Respect but don’t fear
No injuries in the history of the class
M.A,Schmidt 3.155J/6.152J – Lecture 1 FA03 18