1/12
2003 Dec DP0540008_01
Rectifier Diode
Dec,2003
TOSHIBA Semiconductor Company
Discrete Semiconductor Division
2/12
2003 Dec DP0540008_01
0.1
1
10
100
1 10 100 1000
Mounting Area [mm
2
]
Curren
t
Rating [A]
Small Package
High
Power
TFP
MR
I-FLAT2
(SMB)
I-FLAT
(SMA)
M-FLAT
S-FLAT
US-FLAT
High Power & Small Package
PLAN
L-FLAT
D-FLAT
Rectifier Diode,Current vs Mounting Area
3/12
2003 Dec DP0540008_01
Height 0.6mm TYP
Mount Area 1.25 x 2.5mm
0.6
2.5
1.9
1.25
0.98
4.7
3.8
2.4
0.98
3.5
2.6
1.6
US-FLAT
TM
M-FLAT
TM
S-FLAT
TM
Height 0.98mm TYP
Mount Area 1.6 x 3.5mm
Height 0.98mm TYP
Mount Area 2.4 x 4.7mm
Unit:mm
Small
Thin
About
50%Cut
Rectifier Diode,Flat Package Series
4/12
2003 Dec DP0540008_01
S-FLAT
I-FLAT/M-FLAT
USC
Bonding type
Lead Clamp type
Mount Area - Package Rating
0
2
4
6
8
10
12
0 0.2 0.4 0.6 0.8 1 1.2
Package Rating P(W)
Mount
Area(
mm
2
)
US-FLAT
2.5
1.7
1.25
0.9
USC
US-FLAT
0.6
2.5
1.9
1.25
S-MINI
(SC-59)
The mounting area of US-FLAT and USC package are
the same.
US-FLAT is thin flat package of 0.6mm(typ) height.
Moreover,it has high power dissipation according to
lead clamp structure.
High
High Power Rating,Rectifier Diode (Flat Package Series)
5/12
2003 Dec DP0540008_01
(1)Low VF and Low IR
(2)Stable IR
(3)Small Package
Structure
Structure
Trench
SBD
Metal
A
K
P
K
Planar
SBD
Metal
A
P
Part
Max.
Ratings
Electrical Characteristics Remark
Number V
RRM
I
F(AV)
V
FM
I
F
V
R
=5V V
R
=30V
CRS01 30V 1A 0.37V MAX,0.7A 60uA TYP,1.5mA MAX,Low VF
CRS02 30V 1A 0.40V MAX,0.7A 15uA TYP,50uA MAX,Low IR & Low VF
CRS03 30V 1A 0.45V MAX,0.7A 0.5uA TYP,100uA MAX,Low IR
I
RRM
CRS02,VFM=0.4V & IR=50uA
Because of Advanced Trench Structure
Features
Features
VF - IR Trade-off Curve
VF
IR
Trench SBD
Conventional SBD
Improve
Trade-off
CRS03,IR=0.5uA @ VR=5V
Lowest Leakage Current at the Actual
System Bus Voltage
Best Suited for Use in the Voltage
Regulation Circuit of Cellular Phones
CRS01,VFM=0.37V
Very Low Forward Drop
Example
Trench SBD
6/12
2003 Dec DP0540008_01
<< APPLICATIONS >>
Reverse current protection for portable equipment
DC-DC converter etc...
<< FEATURES >>
1) Ultra small and Thin - flat package
Height 0.6mm typ,/ Small space mount (44% cut vs S-FLAT package)
Solder mounting is easy by back flat surface,
2) High current and Low loss,
High surge resistance by the solder mount structure.
US(Ultra Small)-FLAT SBD Line-up and Feature
US(Ultra Small)-FLAT SBD Line-up and Feature
@Ta=25°C
I
RRM
@I
FM
@V
R
=**V
CUS01 1.0A 30V 0.37V max @0.7A 1.5mA max at 30V Low V
F
type OK OK
CUS02 1.0A 30V 0.40V max @0.7A 0.1mA max at 30V Low I
R
type OK OK
CUS03 0.7A 40V 0.55V max @0.7A 100μA max VR=40V SBD OK OK
CUS04 0.7A 60V 0.58V max @0.7A 100μA max VR=60V SBD OK OK
Part
Number
FeaturesI
F(AV)
V
RRM
V
FM
Sample MP
NEW
NEW
NEW
NEW
7/12
2003 Dec DP0540008_01
@Ta=25°C
I
RRM(1)
I
RRM(2)
@I
FM
@V
R
=5V @V
R
=30V
CRS01 1A 30V 0.37V max @0.7A 60μA typ,1.5mA max Low V
F
typ
CRS02 1A 30V 0.4V max @0.7A 15μA typ,50μA max
Low V
F
&
Low I
R
SBD
CRS03 1A 30V 0.45V max @0.7A 0.5μA typ,100μA max Low I
R
typ
CRS04 1A 40V 0.49V max @0.7A 0.5μA typ.
100μA max
@40V
V
R
=40 SBD
CRS05 1A 30V 0.45V max @1A 5μA max,- Low I
R
typ
CRS06 1A 20V 0.36V max @1A 60μA typ.
1mA max
@20V
Low V
F
typ
CRS08 1.5A 30V 0.36V max @1.5A 50μA typ,1mA max Low V
F
typ
CRS09 1.5A 30V 0.46V max @1.5A 0.8μA typ,50μA max Low I
R
typ
CRS11 1A 30V 0.36V max @1A 0.06μA typ,1.5mA max Low V
F
typ
CRS12 1A 60V 0.58V max @1A 5μA typ,100μA max Low I
R
typ
High-Speed &
High-Efficiency
Diodes(HEDs)
CRH01 1A 200V 0.98V max @1A -
10μA max
@200V
trr=35ns Max
FRD -
CRG01 100V
10μA max
@100V
CRG02 400V
10μA max
@400V
CRG03 400V
10μA max
@400V
Power Zener Diodes(PZ)
CRY62
to CRZ47
0.7W
Vz=6.2V
to 47V
1.0V max @0.2A -
10μA max
@Vz*0.8
High Surge
protection
capability
0.7A
General-Purpose
Rectifiers
Kind FeaturesV
FM
V
RRM
I
F(AV)
Part
Number
Small Package
Schottky
Barrier
Diodes
(SBDs)
1.1V max @0.7A -
CRS08/09:I
F
=1.5A
High Current Type
CRS05:IR@VR=5V guarantee
S-FLAT Package Products
S-FLAT Package Products
NEW
NEW
8/12
2003 Dec DP0540008_01
<<APPLICATION>> Portable Equipment
a) Note PC & around equipment(HDD / LCD / CD-R/RW/ROM etc…)
b) Power supply for thin type *Mobile phone *DSC etc...
c) Game,Camcorder
<<FEATURES>>
@ Thin & Flat type package
M-FLAT is thinner flat package with same footprint as I-FLAT.
Lower Profile,I-FLAT” 1.9mm →,M-FLAT” 0.98mm
@Higher Power and Lower Power Losses
High power capability & lower losses products with same mounting area.
1.2
1.2
4.3
1.5
2.4
1.9
I-FLAT
4.7
M-FLAT
0.98
3.8
0.65
1.72.4
0.65
4.7
4.4
1.4
2.1
Unit in mm
M-FLAT(Thinner and Higher Power)
M-FLAT(Thinner and Higher Power)
9/12
2003 Dec DP0540008_01
Group Part Number I
F(AV)
V
RRM
trr V
FM
SPL M/P
SBD
CMS16 3A 40V - 0.55V OK OK
CMH04 1A 200V 35ns 0.98V OK OK
CMH07 2A 200V 35ns 0.98V OK OK
CMH01 3A 200V 35ns 0.98V OK OK
CMG02 2A 400V - 1.10V OK OK
CMZ12-53 2W 12V - 53V - - OK OK
CMZM16 1W 16V - - OK OK
Strobe CMC01 1A 400V I
FRM
=150A 1.00V OK OK
Power Zener
HED
General Purpose
*:Bi-Directional Type
Rectifier Diode Line-up on M-FLAT Package
Rectifier Diode Line-up on M-FLAT Package
NEW
NEW
NEW
NEW
NEW
NEW
NEW
NEW
10/12
2003 Dec DP0540008_01
@Ta=25°C
I
RRM
(1) I
RRM
(2)
@I
FM
@V
R
=5V @V
R
=30V
CMS01 3A 30V 0.37V max @3A 150μA typ 5mA max Low V
F
type
CMS02 3A 30V 0.40V max @3A 50μA typ 0.5mA max Low V
F
& I
R
#
CMS03 3A 30V 0.45V max @3A 3μA typ 0.5mA max Low I
R
type
CMS04 5A 30V 0.37V max @5A 310μA typ 8mA max Low V
F
type
#
CMS05 5A 30V 0.45V max @5A 6μA typ 0.8mA max Low I
R
type
CMS06 2A 30V 0.37V max @2A 90μA typ 3mA max Low V
F
type
#
CMS07 2A 30V 0.45V max @2A 3μA typ 0.5mA max Low I
R
type
CMS08 1A 30V 0.37V max @1A 40μA typ 1.5mA max Low V
F
type
#
CMS09 1A 30V 0.45V max @1A 1.5μA typ 0.5mA max Low I
R
type
#
CMS10 1A 40V 0.55V max @1A 1μA typ 0.5mA max@40V V
R
=40V SBD
#
CMS11 2A 40V 0.55V max @2A 2μA typ 0.5mA max@40V V
R
=40V SBD
#
CMS14 2A 60V 0.58V max @2A 0.6μA typ 0.2mA max@60V V
R
=60V SBD
#
CMS15 3A 60V 0.58V max @3A - 0.3mA max@60V V
R
=60V SBD
#
CMS16 3A 40V 0.55V max @3A - 0.2mA max@60V V
R
=40V SBD
#Tj =150°C
Part Number FeaturesI
F(AV)
V
RRM
V
FM
SBD Line-up on M-FLAT Package
SBD Line-up on M-FLAT Package
NEW
NEW
NEW
11/12
2003 Dec DP0540008_01
8765
12 34
Outline
2.9mm typ.
1.9mm typ.
0.8mm typ.
0.65mm
Plastic Mold
Flat Lead
SBD 2 in 1 Series
Connection
Multi-Chip Device(VS-8 Package)
Multi-Chip Device(VS-8 Package)
Line Up
V
RRM
=5V V
RRM
=30V
TPCF8E02 30 1 0.7μ AT yp 0.1 0.49 O K FBB
Mark
Sample
Schedule
Part
Number
V
RRM
(V) I
F(AV)
(A) V
FM
(V)
I
RRM
(mA)
NEW
12/12
2003 Dec DP0540008_01
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products,No responsibility is assumed
by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products,
Nevertheless,semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability
to physical stress.
It is the responsibility of the buyer,when utilizing TOSHIBA products,to comply with the standards of safety in making a safe design
for the entire system,and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of
human life,bodily injury or damage to property.
In developing your designs,please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications.
Also,please keep in mind the precautions and conditions set forth in the,Handling Guide for Semiconductor Devices,” or
“TOSHIBA Semiconductor Reliability Handbook” etc.
The TOSHIBA products listed in this document are intended for usage in general electronics applications
（computer,personal equipment,office equipment,measuring equipment,industrial robotics,domestic appliances,etc.）.
These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury （“Unintended Usage”）,
Unintended Usage include atomic energy control instruments,airplane or spaceship instruments,transportation instruments,traffic
signal instruments,combustion control instruments,medical instruments,all types of safety devices,etc.
Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk.
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold,under any
law and regulations,
2003 Dec DP0540008_01
Rectifier Diode
Dec,2003
TOSHIBA Semiconductor Company
Discrete Semiconductor Division
2/12
2003 Dec DP0540008_01
0.1
1
10
100
1 10 100 1000
Mounting Area [mm
2
]
Curren
t
Rating [A]
Small Package
High
Power
TFP
MR
I-FLAT2
(SMB)
I-FLAT
(SMA)
M-FLAT
S-FLAT
US-FLAT
High Power & Small Package
PLAN
L-FLAT
D-FLAT
Rectifier Diode,Current vs Mounting Area
3/12
2003 Dec DP0540008_01
Height 0.6mm TYP
Mount Area 1.25 x 2.5mm
0.6
2.5
1.9
1.25
0.98
4.7
3.8
2.4
0.98
3.5
2.6
1.6
US-FLAT
TM
M-FLAT
TM
S-FLAT
TM
Height 0.98mm TYP
Mount Area 1.6 x 3.5mm
Height 0.98mm TYP
Mount Area 2.4 x 4.7mm
Unit:mm
Small
Thin
About
50%Cut
Rectifier Diode,Flat Package Series
4/12
2003 Dec DP0540008_01
S-FLAT
I-FLAT/M-FLAT
USC
Bonding type
Lead Clamp type
Mount Area - Package Rating
0
2
4
6
8
10
12
0 0.2 0.4 0.6 0.8 1 1.2
Package Rating P(W)
Mount
Area(
mm
2
)
US-FLAT
2.5
1.7
1.25
0.9
USC
US-FLAT
0.6
2.5
1.9
1.25
S-MINI
(SC-59)
The mounting area of US-FLAT and USC package are
the same.
US-FLAT is thin flat package of 0.6mm(typ) height.
Moreover,it has high power dissipation according to
lead clamp structure.
High
High Power Rating,Rectifier Diode (Flat Package Series)
5/12
2003 Dec DP0540008_01
(1)Low VF and Low IR
(2)Stable IR
(3)Small Package
Structure
Structure
Trench
SBD
Metal
A
K
P
K
Planar
SBD
Metal
A
P
Part
Max.
Ratings
Electrical Characteristics Remark
Number V
RRM
I
F(AV)
V
FM
I
F
V
R
=5V V
R
=30V
CRS01 30V 1A 0.37V MAX,0.7A 60uA TYP,1.5mA MAX,Low VF
CRS02 30V 1A 0.40V MAX,0.7A 15uA TYP,50uA MAX,Low IR & Low VF
CRS03 30V 1A 0.45V MAX,0.7A 0.5uA TYP,100uA MAX,Low IR
I
RRM
CRS02,VFM=0.4V & IR=50uA
Because of Advanced Trench Structure
Features
Features
VF - IR Trade-off Curve
VF
IR
Trench SBD
Conventional SBD
Improve
Trade-off
CRS03,IR=0.5uA @ VR=5V
Lowest Leakage Current at the Actual
System Bus Voltage
Best Suited for Use in the Voltage
Regulation Circuit of Cellular Phones
CRS01,VFM=0.37V
Very Low Forward Drop
Example
Trench SBD
6/12
2003 Dec DP0540008_01
<< APPLICATIONS >>
Reverse current protection for portable equipment
DC-DC converter etc...
<< FEATURES >>
1) Ultra small and Thin - flat package
Height 0.6mm typ,/ Small space mount (44% cut vs S-FLAT package)
Solder mounting is easy by back flat surface,
2) High current and Low loss,
High surge resistance by the solder mount structure.
US(Ultra Small)-FLAT SBD Line-up and Feature
US(Ultra Small)-FLAT SBD Line-up and Feature
@Ta=25°C
I
RRM
@I
FM
@V
R
=**V
CUS01 1.0A 30V 0.37V max @0.7A 1.5mA max at 30V Low V
F
type OK OK
CUS02 1.0A 30V 0.40V max @0.7A 0.1mA max at 30V Low I
R
type OK OK
CUS03 0.7A 40V 0.55V max @0.7A 100μA max VR=40V SBD OK OK
CUS04 0.7A 60V 0.58V max @0.7A 100μA max VR=60V SBD OK OK
Part
Number
FeaturesI
F(AV)
V
RRM
V
FM
Sample MP
NEW
NEW
NEW
NEW
7/12
2003 Dec DP0540008_01
@Ta=25°C
I
RRM(1)
I
RRM(2)
@I
FM
@V
R
=5V @V
R
=30V
CRS01 1A 30V 0.37V max @0.7A 60μA typ,1.5mA max Low V
F
typ
CRS02 1A 30V 0.4V max @0.7A 15μA typ,50μA max
Low V
F
&
Low I
R
SBD
CRS03 1A 30V 0.45V max @0.7A 0.5μA typ,100μA max Low I
R
typ
CRS04 1A 40V 0.49V max @0.7A 0.5μA typ.
100μA max
@40V
V
R
=40 SBD
CRS05 1A 30V 0.45V max @1A 5μA max,- Low I
R
typ
CRS06 1A 20V 0.36V max @1A 60μA typ.
1mA max
@20V
Low V
F
typ
CRS08 1.5A 30V 0.36V max @1.5A 50μA typ,1mA max Low V
F
typ
CRS09 1.5A 30V 0.46V max @1.5A 0.8μA typ,50μA max Low I
R
typ
CRS11 1A 30V 0.36V max @1A 0.06μA typ,1.5mA max Low V
F
typ
CRS12 1A 60V 0.58V max @1A 5μA typ,100μA max Low I
R
typ
High-Speed &
High-Efficiency
Diodes(HEDs)
CRH01 1A 200V 0.98V max @1A -
10μA max
@200V
trr=35ns Max
FRD -
CRG01 100V
10μA max
@100V
CRG02 400V
10μA max
@400V
CRG03 400V
10μA max
@400V
Power Zener Diodes(PZ)
CRY62
to CRZ47
0.7W
Vz=6.2V
to 47V
1.0V max @0.2A -
10μA max
@Vz*0.8
High Surge
protection
capability
0.7A
General-Purpose
Rectifiers
Kind FeaturesV
FM
V
RRM
I
F(AV)
Part
Number
Small Package
Schottky
Barrier
Diodes
(SBDs)
1.1V max @0.7A -
CRS08/09:I
F
=1.5A
High Current Type
CRS05:IR@VR=5V guarantee
S-FLAT Package Products
S-FLAT Package Products
NEW
NEW
8/12
2003 Dec DP0540008_01
<<APPLICATION>> Portable Equipment
a) Note PC & around equipment(HDD / LCD / CD-R/RW/ROM etc…)
b) Power supply for thin type *Mobile phone *DSC etc...
c) Game,Camcorder
<<FEATURES>>
@ Thin & Flat type package
M-FLAT is thinner flat package with same footprint as I-FLAT.
Lower Profile,I-FLAT” 1.9mm →,M-FLAT” 0.98mm
@Higher Power and Lower Power Losses
High power capability & lower losses products with same mounting area.
1.2
1.2
4.3
1.5
2.4
1.9
I-FLAT
4.7
M-FLAT
0.98
3.8
0.65
1.72.4
0.65
4.7
4.4
1.4
2.1
Unit in mm
M-FLAT(Thinner and Higher Power)
M-FLAT(Thinner and Higher Power)
9/12
2003 Dec DP0540008_01
Group Part Number I
F(AV)
V
RRM
trr V
FM
SPL M/P
SBD
CMS16 3A 40V - 0.55V OK OK
CMH04 1A 200V 35ns 0.98V OK OK
CMH07 2A 200V 35ns 0.98V OK OK
CMH01 3A 200V 35ns 0.98V OK OK
CMG02 2A 400V - 1.10V OK OK
CMZ12-53 2W 12V - 53V - - OK OK
CMZM16 1W 16V - - OK OK
Strobe CMC01 1A 400V I
FRM
=150A 1.00V OK OK
Power Zener
HED
General Purpose
*:Bi-Directional Type
Rectifier Diode Line-up on M-FLAT Package
Rectifier Diode Line-up on M-FLAT Package
NEW
NEW
NEW
NEW
NEW
NEW
NEW
NEW
10/12
2003 Dec DP0540008_01
@Ta=25°C
I
RRM
(1) I
RRM
(2)
@I
FM
@V
R
=5V @V
R
=30V
CMS01 3A 30V 0.37V max @3A 150μA typ 5mA max Low V
F
type
CMS02 3A 30V 0.40V max @3A 50μA typ 0.5mA max Low V
F
& I
R
#
CMS03 3A 30V 0.45V max @3A 3μA typ 0.5mA max Low I
R
type
CMS04 5A 30V 0.37V max @5A 310μA typ 8mA max Low V
F
type
#
CMS05 5A 30V 0.45V max @5A 6μA typ 0.8mA max Low I
R
type
CMS06 2A 30V 0.37V max @2A 90μA typ 3mA max Low V
F
type
#
CMS07 2A 30V 0.45V max @2A 3μA typ 0.5mA max Low I
R
type
CMS08 1A 30V 0.37V max @1A 40μA typ 1.5mA max Low V
F
type
#
CMS09 1A 30V 0.45V max @1A 1.5μA typ 0.5mA max Low I
R
type
#
CMS10 1A 40V 0.55V max @1A 1μA typ 0.5mA max@40V V
R
=40V SBD
#
CMS11 2A 40V 0.55V max @2A 2μA typ 0.5mA max@40V V
R
=40V SBD
#
CMS14 2A 60V 0.58V max @2A 0.6μA typ 0.2mA max@60V V
R
=60V SBD
#
CMS15 3A 60V 0.58V max @3A - 0.3mA max@60V V
R
=60V SBD
#
CMS16 3A 40V 0.55V max @3A - 0.2mA max@60V V
R
=40V SBD
#Tj =150°C
Part Number FeaturesI
F(AV)
V
RRM
V
FM
SBD Line-up on M-FLAT Package
SBD Line-up on M-FLAT Package
NEW
NEW
NEW
11/12
2003 Dec DP0540008_01
8765
12 34
Outline
2.9mm typ.
1.9mm typ.
0.8mm typ.
0.65mm
Plastic Mold
Flat Lead
SBD 2 in 1 Series
Connection
Multi-Chip Device(VS-8 Package)
Multi-Chip Device(VS-8 Package)
Line Up
V
RRM
=5V V
RRM
=30V
TPCF8E02 30 1 0.7μ AT yp 0.1 0.49 O K FBB
Mark
Sample
Schedule
Part
Number
V
RRM
(V) I
F(AV)
(A) V
FM
(V)
I
RRM
(mA)
NEW
12/12
2003 Dec DP0540008_01
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products,No responsibility is assumed
by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use,
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products,
Nevertheless,semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability
to physical stress.
It is the responsibility of the buyer,when utilizing TOSHIBA products,to comply with the standards of safety in making a safe design
for the entire system,and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of
human life,bodily injury or damage to property.
In developing your designs,please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications.
Also,please keep in mind the precautions and conditions set forth in the,Handling Guide for Semiconductor Devices,” or
“TOSHIBA Semiconductor Reliability Handbook” etc.
The TOSHIBA products listed in this document are intended for usage in general electronics applications
（computer,personal equipment,office equipment,measuring equipment,industrial robotics,domestic appliances,etc.）.
These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality
and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury （“Unintended Usage”）,
Unintended Usage include atomic energy control instruments,airplane or spaceship instruments,transportation instruments,traffic
signal instruments,combustion control instruments,medical instruments,all types of safety devices,etc.
Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk.
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold,under any
law and regulations,
