? Semiconductor Components Industries,LLC,2004
April,2004? Rev,2
1 Publication Order Number:
MBRS3200T3/D
MBRS3200T3
Surface Mount
Schottky Power Rectifier
.,,employing the Schottky Barrier principle in a large area
metal?to?silicon power diode,State?of?the?art geometry features
epitaxial construction with oxide passivation and metal overlay
contact,Ideally suited for low voltage,high frequency rectification,or
as free wheeling and polarity protection diodes in surface mount
applications where compact size and weight are critical to the system.
Small Compact Surface Mountable Package with J?Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very High Blocking Voltage? 200 V
150°C Operating Junction Temperature
Guardring for Stress Protection
Mechanical Characteristics
Case,Epoxy,Molded,Epoxy Meets UL94,VO
Weight,95 mg (approximately)
Finish,All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max,for 10 Seconds
Shipped in 12 mm Tape and Reel,2500 units per reel
Cathode Polarity Band
Device Meets MSL 1 Requirements
ESD Ratings,Machine Model = A
ESD Ratings,Human Body Model = 1C
Marking,B320
Pb?Free Package is Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
200 V
Average Rectified Forward Current
(T
L
= 120 °C)
I
F(AV)
3.0 A
Non?Repetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Halfwave,Single Phase,60 Hz)
I
FSM
100 A
Operating Junction Temperature T
J
65 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously,If these limits
are exceeded,device functional operation is not implied,damage may occur
and reliability may be affected.
Device Package Shipping
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
MBRS3200T3 SMB 2500/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERE
200 VOLTS
MARKING DIAGRAM
B320
B320 = Device Code
http://onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes,please
refer to our Tape and Reel Packaging Specification
Brochure,BRD8011/D.
MBRS3200T3G SMB
(Pb?Free)
2500/Tape & Reel
MBRS3200T3
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance? Junction?to?Lead (Note 1)
Thermal Resistance? Junction?to?Ambient (Note 2)
R
JL
R
JA
13
62
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(I
F
= 3.0 A,T
J
= 25°C)
(I
F
= 4.0 A,T
J
= 25°C)
(I
F
= 3.0 A,T
J
= 150°C)
V
F
0.84
0.86
0.59
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage,T
J
= 25°C)
(Rated dc Voltage,T
J
= 150°C)
I
R
5.0
5.0
A
mA
1,Minimum pad size (0.108 × 0.085 inch) for each lead on FR4 board
2,1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board
3,Pulse Test,Pulse Width = 300 s,Duty Cycle ≤ 2.0%.
MBRS3200T3
http://onsemi.com
3
100
1
0.1
10.2 0.3 0.4 0.5 0.6 0.7
V
F
,INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1,Typical Forward Voltage Figure 2,Maximum Forward Voltage
10
0.8 0.9 1.1 1.2
I
F
,FOR
W
ARD CURRENT (AMPS)
T
C
= 25°CT
C
= 150°C
T
C
= 100°C
100
1
0.1
10.2 0.3 0.4 0.5 0.6 0.7
V
F
,INSTANTANEOUS VOLTAGE (VOLTS)
10
0.8 0.9 1.1 1.2
I
F
,FOR
W
ARD CURRENT (AMPS)
T
C
= 25°C
T
C
= 150°C
T
C
= 100°C
1.0E?09
1600 20 40 60 80 100
V
R
,REVERSE VOLTAGE (VOLTS)
Figure 3,Typical Reverse Current Figure 4,Typical Capacitance
120 140 180 200
I
R
,REVERSE CURRENT (AMPS)
T
C
= 25°C
T
C
= 150°C
T
C
= 100°C
1000
10
1600 20 40 60 80 100
V
R
,REVERSE VOLTAGE (VOLTS)
100
120 140 180 200
C,CAP
ACIT
ANCE (pF)
T
C
= 25°C
f = 1 MHz
1.0E?08
1.0E?07
1.0E?06
1.0E?05
1.0E?04
1.0E?03
Typical Capacitance
at 0 V = 209 V
0
15080 90 100 110 120
T
L
,LEAD TEMPERATURE (°C)
Figure 5,Current Derating? Lead Figure 6,Forward Power Dissipation
130 140 160
I
F
,A
VERAGE FOR
W
ARD CURRENT (AMPS)
5
0
40123
I
O
,AVERAGE FORWARD CURRENT (AMPS)
2.5
56
P
fo
,A
VERAGE POWER DISSIP
A
TION (W)
1
2
3
4
6
7
5
SQUARE WAVE
dc
0.5
1
1.5
2
4.5
3
3.5
4 SQUARE WAVE
dc
MBRS3200T3
http://onsemi.com
4
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A?03
ISSUE D
A
S
D
B
J
PK
C
H
NOTES:
1,DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2,CONTROLLING DIMENSION,INCH.
3,D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.160 0.180 4.06 4.57
B 0.130 0.150 3.30 3.81
C 0.075 0.095 1.90 2.41
D 0.077 0.083 1.96 2.11
H 0.0020 0.0060 0.051 0.152
J 0.006 0.012 0.15 0.30
K 0.030 0.050 0.76 1.27
P 0.020 REF 0.51 REF
S 0.205 0.220 5.21 5.59
mm
inches
SCALE 8:1
2.743
0.108
2.159
0.085
2.261
0.089
*For additional information on our Pb?Free strategy and soldering
details,please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual,SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries,LLC (SCILLC),SCILLC reserves the right to make changes without further notice
to any products herein,SCILLC makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose,nor does SCILLC assume any liability
arising out of the application or use of any product or circuit,and specifically disclaims any and all liability,including without limitation special,consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time,All
operating parameters,including,Typicals” must be validated for each customer application by customer’s technical experts,SCILLC does not convey any license under its patent rights
nor the rights of others,SCILLC products are not designed,intended,or authorized for use as components in systems intended for surgical implant into the body,or other applications
intended to support or sustain life,or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur,Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application,Buyer shall indemnify and hold SCILLC and its officers,employees,subsidiaries,affiliates,
and distributors harmless against all claims,costs,damages,and expenses,and reasonable attorney fees arising out of,directly or indirectly,any claim of personal injury or death
associated with such unintended or unauthorized use,even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part,SCILLC is an Equal
Opportunity/Affirmative Action Employer,This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N,American Technical Support,800?282?9855 Toll Free
USA/Canada
Japan,ON Semiconductor,Japan Customer Focus Center
2?9?1 Kamimeguro,Meguro?ku,Tokyo,Japan 153?0051
Phone,81?3?5773?3850
MBRS3200T3/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O,Box 5163,Denver,Colorado 80217 USA
Phone,303?675?2175 or 800?344?3860 Toll Free USA/Canada
Fax,303?675?2176 or 800?344?3867 Toll Free USA/Canada
Email,orderlit@onsemi.com
ON Semiconductor Website,http://onsemi.com
Order Literature,http://www.onsemi.com/litorder
For additional information,please contact your
local Sales Representative.
April,2004? Rev,2
1 Publication Order Number:
MBRS3200T3/D
MBRS3200T3
Surface Mount
Schottky Power Rectifier
.,,employing the Schottky Barrier principle in a large area
metal?to?silicon power diode,State?of?the?art geometry features
epitaxial construction with oxide passivation and metal overlay
contact,Ideally suited for low voltage,high frequency rectification,or
as free wheeling and polarity protection diodes in surface mount
applications where compact size and weight are critical to the system.
Small Compact Surface Mountable Package with J?Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very High Blocking Voltage? 200 V
150°C Operating Junction Temperature
Guardring for Stress Protection
Mechanical Characteristics
Case,Epoxy,Molded,Epoxy Meets UL94,VO
Weight,95 mg (approximately)
Finish,All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max,for 10 Seconds
Shipped in 12 mm Tape and Reel,2500 units per reel
Cathode Polarity Band
Device Meets MSL 1 Requirements
ESD Ratings,Machine Model = A
ESD Ratings,Human Body Model = 1C
Marking,B320
Pb?Free Package is Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
200 V
Average Rectified Forward Current
(T
L
= 120 °C)
I
F(AV)
3.0 A
Non?Repetitive Peak Surge Current
(Surge Applied at Rated Load Condi-
tions Halfwave,Single Phase,60 Hz)
I
FSM
100 A
Operating Junction Temperature T
J
65 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously,If these limits
are exceeded,device functional operation is not implied,damage may occur
and reliability may be affected.
Device Package Shipping
ORDERING INFORMATION
SMB
CASE 403A
PLASTIC
MBRS3200T3 SMB 2500/Tape & Reel
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERE
200 VOLTS
MARKING DIAGRAM
B320
B320 = Device Code
http://onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes,please
refer to our Tape and Reel Packaging Specification
Brochure,BRD8011/D.
MBRS3200T3G SMB
(Pb?Free)
2500/Tape & Reel
MBRS3200T3
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance? Junction?to?Lead (Note 1)
Thermal Resistance? Junction?to?Ambient (Note 2)
R
JL
R
JA
13
62
°C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 3)
(I
F
= 3.0 A,T
J
= 25°C)
(I
F
= 4.0 A,T
J
= 25°C)
(I
F
= 3.0 A,T
J
= 150°C)
V
F
0.84
0.86
0.59
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage,T
J
= 25°C)
(Rated dc Voltage,T
J
= 150°C)
I
R
5.0
5.0
A
mA
1,Minimum pad size (0.108 × 0.085 inch) for each lead on FR4 board
2,1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board
3,Pulse Test,Pulse Width = 300 s,Duty Cycle ≤ 2.0%.
MBRS3200T3
http://onsemi.com
3
100
1
0.1
10.2 0.3 0.4 0.5 0.6 0.7
V
F
,INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1,Typical Forward Voltage Figure 2,Maximum Forward Voltage
10
0.8 0.9 1.1 1.2
I
F
,FOR
W
ARD CURRENT (AMPS)
T
C
= 25°CT
C
= 150°C
T
C
= 100°C
100
1
0.1
10.2 0.3 0.4 0.5 0.6 0.7
V
F
,INSTANTANEOUS VOLTAGE (VOLTS)
10
0.8 0.9 1.1 1.2
I
F
,FOR
W
ARD CURRENT (AMPS)
T
C
= 25°C
T
C
= 150°C
T
C
= 100°C
1.0E?09
1600 20 40 60 80 100
V
R
,REVERSE VOLTAGE (VOLTS)
Figure 3,Typical Reverse Current Figure 4,Typical Capacitance
120 140 180 200
I
R
,REVERSE CURRENT (AMPS)
T
C
= 25°C
T
C
= 150°C
T
C
= 100°C
1000
10
1600 20 40 60 80 100
V
R
,REVERSE VOLTAGE (VOLTS)
100
120 140 180 200
C,CAP
ACIT
ANCE (pF)
T
C
= 25°C
f = 1 MHz
1.0E?08
1.0E?07
1.0E?06
1.0E?05
1.0E?04
1.0E?03
Typical Capacitance
at 0 V = 209 V
0
15080 90 100 110 120
T
L
,LEAD TEMPERATURE (°C)
Figure 5,Current Derating? Lead Figure 6,Forward Power Dissipation
130 140 160
I
F
,A
VERAGE FOR
W
ARD CURRENT (AMPS)
5
0
40123
I
O
,AVERAGE FORWARD CURRENT (AMPS)
2.5
56
P
fo
,A
VERAGE POWER DISSIP
A
TION (W)
1
2
3
4
6
7
5
SQUARE WAVE
dc
0.5
1
1.5
2
4.5
3
3.5
4 SQUARE WAVE
dc
MBRS3200T3
http://onsemi.com
4
PACKAGE DIMENSIONS
SMB
PLASTIC PACKAGE
CASE 403A?03
ISSUE D
A
S
D
B
J
PK
C
H
NOTES:
1,DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M,1982.
2,CONTROLLING DIMENSION,INCH.
3,D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.160 0.180 4.06 4.57
B 0.130 0.150 3.30 3.81
C 0.075 0.095 1.90 2.41
D 0.077 0.083 1.96 2.11
H 0.0020 0.0060 0.051 0.152
J 0.006 0.012 0.15 0.30
K 0.030 0.050 0.76 1.27
P 0.020 REF 0.51 REF
S 0.205 0.220 5.21 5.59
mm
inches
SCALE 8:1
2.743
0.108
2.159
0.085
2.261
0.089
*For additional information on our Pb?Free strategy and soldering
details,please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual,SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries,LLC (SCILLC),SCILLC reserves the right to make changes without further notice
to any products herein,SCILLC makes no warranty,representation or guarantee regarding the suitability of its products for any particular purpose,nor does SCILLC assume any liability
arising out of the application or use of any product or circuit,and specifically disclaims any and all liability,including without limitation special,consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time,All
operating parameters,including,Typicals” must be validated for each customer application by customer’s technical experts,SCILLC does not convey any license under its patent rights
nor the rights of others,SCILLC products are not designed,intended,or authorized for use as components in systems intended for surgical implant into the body,or other applications
intended to support or sustain life,or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur,Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application,Buyer shall indemnify and hold SCILLC and its officers,employees,subsidiaries,affiliates,
and distributors harmless against all claims,costs,damages,and expenses,and reasonable attorney fees arising out of,directly or indirectly,any claim of personal injury or death
associated with such unintended or unauthorized use,even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part,SCILLC is an Equal
Opportunity/Affirmative Action Employer,This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N,American Technical Support,800?282?9855 Toll Free
USA/Canada
Japan,ON Semiconductor,Japan Customer Focus Center
2?9?1 Kamimeguro,Meguro?ku,Tokyo,Japan 153?0051
Phone,81?3?5773?3850
MBRS3200T3/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O,Box 5163,Denver,Colorado 80217 USA
Phone,303?675?2175 or 800?344?3860 Toll Free USA/Canada
Fax,303?675?2176 or 800?344?3867 Toll Free USA/Canada
Email,orderlit@onsemi.com
ON Semiconductor Website,http://onsemi.com
Order Literature,http://www.onsemi.com/litorder
For additional information,please contact your
local Sales Representative.
